Broadcom said that the explosion of data from artificial intelligence (AI) is the driver behind the expansion of its Sian line of digital signal processors.
The Sian2 offers 200 Gbps electrical and optimal per lane performance. It is optimized for 800G/1.6T links AI clusters. The company says that goal was to reach this capacity while maintaining low latency, power use, and cost per bit.
“200G/lane DSP is foundational to high-speed optical links for next generation scale-up and scale-out networks in the AI infrastructure,” Vijay Janapaty, the vice president and general manager of Broadcom’s Physical Layer Products Division, said in a press release. “The Sian family of products reinforces Broadcom’s leadership in optical DSP PHYs and enables our AI data center customers to deploy high-performance 800G and 1.6T links.”
The Sian2 BCM8582X is available for sampling to its access customers and partners.
Highlights of Sian 2, according to Broadcom:
- Low power 5nm 200G/lane DSP solution enabling sub-28W 1.6T transceivers
- Supports 800G, 1.6T pluggable modules
- Support for both 212.5-Gb/s and 226.875-Gb/s data rates for InfiniBand and Ethernet applications
- Support for multiple FEC options including Bypass, Segmented and Concatenated FEC
- Built-in low-swing and high-swing laser driver for both SiP and EML based optical modules
- Sub-80ns roundtrip (Ingress + Egress) latency for AI/ML applications
- Crossbar support for ease of transceiver design
The data trafficking challenges AI is likely to bring to the telecommunications and IT industries are moving center stage. Earlier this month, Mobile Experts suggested that the total amount as well as the change in the dynamic from mostly symmetrical to symmetrical is a serious issue. It said that generative AI enhancements that are expected to arrive soon “could be the turning point.”
